Power electronic packaging design, assembly process, reliability and modeling
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...
| Hlavní autor: | |
|---|---|
| Médium: | Kniha |
| Jazyk: | angličtina |
| Vydáno: |
New York :
Springer
[2012]
©2012 |
| Témata: | |
| Umístění: |
UNIZA |
