Obálka

Power electronic packaging design, assembly process, reliability and modeling

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...

Celý popis

Podrobná bibliografia
Hlavný autor: Liu, Yong (Autor)
Médium: Kniha
Jazyk:angličtina
Vydavateľské údaje: New York : Springer [2012]
©2012
Téma:
výkonová elektronika
Power electronics
monografie
Monographs
Umiestnenie:
Univerzitná knižnica Žilinskej univerzity